Vertical Stacking

In certain applications, size and weight restrictions are so demanding that vertically stacking die is the only practical means of achieving the physical design requirements. These applications typically require the fitting of relatively large digital memory needs in small spaces. Memory die (DRAMs, SRAMs, Flash, etc.) are the primary candidates for stacking due to their very large proportion of usage in memory intensive circuits.

Applications where stacked die may be the only practical solution include not just spacecraft programs but military and commercial applications as well. Any large data storage application with a cramped form factor is a candidate. Digital imagery requirements (maps, photos, video, surveillance data, etc.) are memory intensive applications. Mobile terminals of all kinds (video phones, laptops, cameras, PDAs, etc.) are shrinking rapidly in a continuing challenge to the packaging designer. Stacked die solutions are becoming more and more prevalent as a result.


		Stacked Die Manufacturers