  
As a result, the risk of using a commercial product (e.g. a DRAM die) in a military or spacecraft application (e.g. beyond commercial temperature limits) rests solely with the customer. This risk applies to yield loss of good commercial die when tested beyond commercial limits as well as functional performance within the end application under stresses beyond the limits of the published data sheets. The technical staff at DD & S can help to mitigate these risks to the customer by designing and implementing special testing and/or processing protocols for bare die or wafers. Qualified third parties under the direction and supervision of DD & S personnel perform such testing and/or processing.
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