Stacked Die Manufacturers

There are several third party manufacturers of stacked die packaging. Each uses a different design approach for stacking die. As an example of how diverse these designs can be just consider this partial listing of manufacturers that advertise having one form of stacking technology or another:

· 3D Plus · IBM · Tessera · Altera · Intel Corporation · Toshiba · Amkor Technology · Irvine Sensors · Toshiba/ Misazu · APack Technologies · Mitsubishi Electric · Tru-Si Technologies · Array Packaging Tech. · Mitsui High-Tec · Unitive Electronics · ChipPAC · NEC · Valtronic S.A. · Dense-Pak · Sharp Electronics · Vate Technology · Epson /Seiko Epson · Silicon Bandwidth · Vertical Circuits Inc. · Fujitsu Microelectronics · Siliconware

The techniques employed by these manufacturers vary from a simplistic stacking of standard packaged parts to extremely dense stacks of bare die. In each case, there are PROS and CONS associated with the use of these various designs.

The technical staff at DD & S is familiar with the more established of these die stacking manufacturers and their techniques, having surveyed their capabilities and actually utilized several of them for stacked die packaging. From this perspective, DD & S is in an ideal position to offer the customer objective consultation regarding the design trade-offs associated with each technology offered. Furthermore, DD & S personnel are available to develop and manage a stacked die packaging program with a qualified manufacturer.


		Package Types 101