Special testing and/or processing of microcircuits are commonly associated with packaged devices, also referred to as “up-screening.” The military and spacecraft communities have evolved detailed specifications to validate semiconductor devices of all types for their intended use in these environments (e.g. MIL-PRF-38535). However, in the case of bare (unpackaged) die one must deal with the real-world practicalities of such special testing and/or processing . . .particularly when considering the use of devices manufactured to commercial standards (COTS). This discussion addresses some of these issues. The starting point for any consideration of special testing and/or processing is to understand and accept the fact that most manufacturers of microcircuits guarantee device performance to the published specifications of any given part type and nothing more. This performance guarantee usually stipulates an operating temperature range of 0ºC to +70ºC. While many devices are capable of useful operation well beyond these limits, the manufacturer does not guarantee such performance. The typical specification for operating temperature range in military and spacecraft applications is –55ºC to +125ºC, more than twice the commercial range. User Risk DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services