Seal and Encapsulation Methods (1) HERMETIC – SEAM SEAL PROS: hermetic, low temperature, large seal area, low profile, minimal floor space requirements CONS: low throughput ISSUES: dry box environment, electrode design, lid design, substrate size (2) NON-HERMETIC – GLOB TOP PROS: flexible, low temperature, low stress, low profile CONS: non-hermetic, limited protection, spread, wire wash potential ISSUES: dispensing parameters, viscosity, dams, cure With this variety of die assembly options from which to choose it is useful to seek expert advise when designing for reliability. The technical staff at DD & S is available for consultation on such issues. Such consultation is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request. Packaging for Shipment DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services