This DD & S Reference Guide is organized in eight “disciplines” (or sections) pertaining to die and wafer usage. Within each discipline, are additional pages that may be accessed by clicking on the hotlinks at the bottom of the particular page. Also, all pages can be found in the Site Map or by viewing the Index. If the subject title is known it may be located via the Search button. The Eight Disciplines are (1) Semiconductor Applications, (2) Custom Packaging Design, (3) Test & Processing Design, (4) Multiple Die Modules & Stacks, (5) Reliability Analysis, (6) Thermal/Mechanical Modeling, (7) Comprehensive Failure Analysis, and (8) Radiation Test and Analysis.The hotlinks for these sections are below. Within the Test & Processing Design section are two helpful pages for those new to the use of die (unpackaged) and wafers: "Sequence of a Die or Wafer Order" and "Sequence of a Die or Wafer Order With Testing". DD & S offers technical support and services in addition to the access of silicon die and wafers. We have the capability to assist in your application, provide custom solutions, or designs. We have access to various third party techniques of value added manufacturing or our team can supply them. This effort is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request. |
| DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services |