Reliability Program Basics

(a) The customers’ expectations and needs must be fully understood. (b) Suppliers must be actively committed to meeting the reliability objective. (c) Design and manufacturing that impacts reliability must be an integral part of the engineering process. (d) The device must be designed for the intended use/environment. (e) Reliability of the design must be verified.

A blueprint for implementing a typical Reliability Engineering Program can be found at http://www.weibull.com (Click on the link below)

Weibull.com provides resources for the professional in reliability engineering.

Packaged parts are discrete circuit elements that lend themselves to such analysis by the device manufacturer since the manufacturer controls the fabrication process of the subject device. However, from the customer’s standpoint, the issue of reliability analysis is focused on next-level assemblies. The principles of reliability analysis apply to assembled products just as they apply to individual devices. Unpackaged die are not easily isolated as discrete circuit elements for reliability analysis by the customer. Therefore, in the case of bare die mounted in multi-chip-modules (MCMs), the MCM assembly as a whole is the focus of reliability analysis rather than the individual die.

The technical staff of DD & S is experienced in the design and implementation of reliability programs for MCMs as well as for discrete devices. For critical projects where reliability is a key consideration, DD & S can be of assistance. This effort is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request.


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