As might be expected, a unique vocabulary of package designations has also evolved to describe the different approaches to packaging die, such as · DIP - Dual In-line Package · TSOP- Thin Small Outline Package · CC - Chip Carrier · QFP - Quad Flat Pack · PGA - Pin Grid Array · BGA - Ball Grid Array · CSP - Chip Scale Package The stacking of standard TSOP microcircuit packages may be suitable for certain commercial applications but this approach does not typically satisfy the more demanding applications found in military and spacecraft equipment. A customer who is stacking TSOPs in any form WOULD NOT INVOLVE DD & S. CSP to Be 10% of the Total Market Where ultra-dense packaging is required, the stacking of bare die is usually the better solution with some form of a chip scale package (CSP). This is where DD & S can perform. Since CSP packaging is projected to become 10% of the total IC market for all package types by the year 2005, it is evident that custom packaging of bare die is a growing technological opportunity. DD & S can provide expert assistance with the design and implementation of these third party activities. Such assistance is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request. Technical Reference Guide Reliability Analysis DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services