Die and wafers are delivered to the customer in the manufacturer’s original packaging. They are not opened by DD & S prior to customer delivery. In addition to offering bare die in shipping containers just as they are received from the manufacturer, DD & S offers custom re-packing under controlled-environmental conditions to suit customer needs. Such custom packing is necessary whenever the customer specifies supplemental parametric testing beyond that normally provided by the die manufacturer. An example would be when the application calls for known-good-die (KGD) with application-specific performance-validation testing instead of standard wafer mapping to spec sheet parameters (see Test and Processing Design below). All such repackaging is accomplished under controlled conditions by qualified third-party die-test and die-processing companies. The technical staff at DD & S is available to provide technical supervision of this activity at the third-party premises. Such supervision is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request. Test & Processing Design Technical Reference Guide DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services