Multi Die Modules & Stacks

Common Use of Bare Die

Vertical Stacking

Stacked Die Manufacturers

Package Types 101

OVERVIEW

To reduce product size, companies who are developing portable and hand-held electronic products are seeking solutions that will furnish more functionality within each device. Portable or hand-held electronics are a natural target for die usage. Digital cameras and camcorders, for example, must consider ease of use, lighter weight and performance. Telephones, pagers, personal communicators, palm top computers, industrial and automotive electronics, personal GPS, medical and diagnostic products, are all viable candidates for more efficient device miniaturization by using die (unpackaged). Memory devices are the first commodity type products in the market to adapt CSP in high volume; however, DSP, controllers, CPUs and any number of application specific IC devices are also prime candidates for multiple die packaging.

Highly demanding applications where space and/or weight are at a premium, the DD & S staff can provide expert packaging design of multiple die packages and/or vertically stacked packages of multiple die. Having successfully managed multi-million dollar programs for stacked die packages and hybrid packages of multiple die, the company’s staff can evaluate the technical trade-offs for a given application and actually manage the package design and third party manufacture of such state-of-the-art packaging options. Where the end application dictates these compact designs, it is imperative to avoid the potential pitfalls attendant with the use of bare die. Such assistance is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request.