All designers of MCMs are aware that adequate heat transfer is mandatory in every design they produce. When there is abundant real estate on the substrate for die mounting and the die utilized in the circuit do not dissipate excessive power (e.g. DRAMs) thermal dissipation issues are not challenging. However, abundant real estate is always a myth, few circuits are comprised exclusively of DRAMs, and even stacked DRAMs can present thermal management problems due to their increased power density. Therefore, thermal analysis is an essential requirement in virtually every new design that utilizes unpackaged die. Thermal analysis of a new product typically starts by thermally modeling the product. This is a tricky task when an extreme environmental requirement is encountered and/or the packaging density demands are severe. In such cases, simply understanding the path of heat flow and applying some assumed thermal impedance value to it would not yield suitable results. Thermal Model DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services