Guide to Eight Disciplines

The Eight Disciplines are (1) Semiconductor Applications,

(2) Custom Packaging Design,

(3) Test & Processing Design,

(4) Multiple Die Modules & Stacks,

(5) Reliability Analysis,

(6) Thermal/Mechanical Modeling,

(7) Comprehensive Failure Analysis, and

(8) Radiation Test and Analysis.

The sections pertaining to these disciplines are in this order beginning with the Reference Guide button on the left.


		Technical Reference Guide