OVERVIEW A critical aspect of reliability in any bare die application is the physical design, each of which represents a unique mechanical system. This includes the methods, processes and materials in the mounting and bonding of the die to the circuit board or chip carrier. All die mounting and bonding applications must be analyzed for materials compatibility, mechanical and thermal stress tolerance and exposure to deleterious environments during assembly, test and field operations. The DD & S technical staff provides an expert review of each application to flag potential reliability issues and recommend appropriate remedies. This expertise is derived from a myriad of step-stress testing programs conducted to validate various materials and processes utilized for high-reliability space programs. A wide variety of die assembly methods are available for implementation into high yield, high reliability systems. Some of the options follow, each with their inherent Pros, Cons and Issues: Die Attach Methods Interconnect Methods Seal & Encapsulation Packaging for Shipment DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services