  
The most common use of bare die in equipment designs of all types is found in two-dimensional hybrid circuits . . . commonly called multi-chip modules (MCMs). Such designs typically utilize a ceramic substrate on which are mounted various arrays of individual die on the planar surface of the substrate. Some of the more popular methods of mounting and bonding the die to the substrate are described in the section titled Custom Packaging Design. There are many manufacturing firms that are proficient in the design and assembly of such hybrid circuits. These hybrid manufacturers typically have sufficient engineering resources of their own that they will not seek additional mounting and bonding expertise from DD & S. However, such manufacturers may very well look to DD & S for assistance in the structuring and management of a special testing or processing protocol on the die or wafers they purchase, as described in the Test & Processing Design section. For customers not proficient in hybrid design and assembly but still challenged by size and/or weight constraints, the technical staff at DD & S can be an effective resource. DD & S has the technical expertise to select and manage third party hybrid design and manufacturing projects.
|