OVERVIEW As device geometries continue to shrink and new materials are introduced, the structural intricacy of failure analysis grows. Many of the structures created by these new designs and materials are complex requiring techniques that penetrate back through several layers of the device. Thus, the defects and structural causes of device failure are often hidden, not merely surface related. With techniques such as metallography, image analysis, scanning electron microscopy (SEM), fractography, electron-probe microanalysis (EPMA), chemical analysis, surface analysis, and x-ray diffraction, failure investigators can determine the cause of failure and recommend process changes to solve future problems. Structural diagnoses for defect characterization and failure analysis allow the investigator to analyze complex structural failures, understand the materials and the sources of defects. DD & S provides expert assistance with the design and implementation of Failure Analysis work. This effort is a special service beyond the basic cost of the die or wafers and is quoted as a separate item upon request. For those new to failure analysis, what follows is a broad, cursory introduction to basic analysis techniques and tools of the trade. IBM has a good “Making Semiconductors” and “Packaging Semiconductors” site for basic manufacturing background and should be of interest to those wishing an understanding of the subject: http://www-3.ibm.com/chips/bluelogic/manufacturing/makechip/ (Copy and paste in your browser address line or click below) Failure Analysis Issues/Techniques A Few Tools of the Trade Making Semiconductors DIE & WAFER MEMORY SPECIALISTS Copyright 2000-2008 Die Delivery and Services